It seems that SK Hynix has secretly revealed some of the specs of its next generation high bandwidth memory, HBM3. Still under development, it will soon be ready for use in HPC servers and super high-end next-generation graphics cards. From the specifications, it looks like this new memory interface will be a big boost compared to current memory standards.

This information comes from SK Hynix's post on HBM2E (via NordicHardware), and the comparison graph shows the performance trends for the next big thing, the HBM3 memory interface.

The maximum pin transfer rate of HBM3 appears to be stepping up from the current 3.2Gbps standard of HBM2 and HBM2E to a quick 5.2Gbps. Such sterling I/O speeds mean a 44% increase in transfer rates, which is great for serious graphics enthusiasts (perhaps more than gamers).

This also means that previous rumors of HBM3 coming with a bandwidth of about 512GB/s are a bit off; according to SK Hynix, it is now expected to be 665GB/s, which is 2.6 times the 24GB of HBM2E and all the way up to the alternative GDDR6X capacity could be backed by a larger capacity of 64GB, which would be equivalent to the capacity of the alternative GDDR6X.

To be sure, these numbers are more likely to delight GPU miners than gamers, but Ethereum loves its bandwidth so much, as the rumored new monster Nvidia mining cards prove.

No word on whether heat dissipation has been further improved or anything else. But the results do give us hope for many of the next professional graphics cards: the price of HBM3 may come down until it can replace GDD6 in gaming GPUs, but that would be mere wishful thinking.

Of course, these may change as SK Hynix moves forward with the final stages of development, but the current performance trends look good.